Development of a millimeter-wave system-on-a-package utilizing MCM integration

TitleDevelopment of a millimeter-wave system-on-a-package utilizing MCM integration
Publication TypeJournal Article
Year of Publication2001
AuthorsPham, A., R. Ramachandran, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu
JournalMicrowave Theory and Techniques, IEEE Transactions on
Pagination1747 -1749
Date Publishedoct.
Keywordsdigital ASIC, filter, integral passive device, integrated circuit packaging, MCM integration, microelectromechanical device, millimeter-wave system-on-a-package, millimetre wave integrated circuits, multichip modules, multilayer polymer thin film, radiofrequency integrated circuit, thin film resistor, Wilkinson power combiner

We present the development of a system-on-a-package at millimeter-wave frequencies utilizing a commercially available multichip-module process. This technology has established a platform for integrating multiple components of different material systems to combine digital application-specific integrated circuits (ASICs), radio-frequency integrated circuits, and microelectromechanical devices onto a package. The multilayer polymer thin films also empower the design and fabrication of integral passive devices, including thin-film resistors, filters, and Wilkinson power combiners


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