Plastic microwave multi-chip modules for wireless communication applications

TitlePlastic microwave multi-chip modules for wireless communication applications
Publication TypeConference Paper
Year of Publication1998
AuthorsKrishnamurthy, V., E. Balch, K. Durocher, J. Rose, R. Saia, D. Lester, and D. Sherwood
Conference NameRadio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE
Pagination127 -130
Date Publishedjun.
Keywords-20 dB, 1.6 to 2 GHz, coplanar vertical interconnect, high density MCMs, low thermal resistance solder attach, microwave circuits, microwave multi-chip modules, multichip modules, plastic microwave MCM, plastic packaging, T/R modules, thermal resistance, vertical feed throughs, wireless communication applications
Abstract

This paper describes a high density, microwave plastic multi-chip module (MCM) with vertical feed throughs providing RF/DC I/Os at the module backside allowing for a low thermal resistance solder attach to a printed circuit board. A return loss of better than -20 dB up to approximately 3.8 GHz was measured for the coplanar vertical interconnect from the plastic module to a printed circuit board. Functional T/R modules operating between 1.60 GHz and 2.0 GHz were also fabricated with this technology

URLhttp://dx.doi.org/10.1109/RFIC.1998.682063
DOI10.1109/RFIC.1998.682063

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