Ground bounce calculation due to simultaneous switching in deep sub-micron integrated circuits

TitleGround bounce calculation due to simultaneous switching in deep sub-micron integrated circuits
Publication TypeConference Paper
Year of Publication2005
AuthorsHekmat, M., M. S, and M. Hashemi
Conference NameCircuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on
Pagination5617 - 5620 Vol. 6
Date Publishedmay.
Keywordsbond wires, deep sub-micron integrated circuits, digital integrated circuits, ground bounce calculation, ground variation, integrated circuit modelling, integrated circuit noise, integrated circuit packaging, linear equations, mixed analogue-digital integrated circuits, mixed-mode integrated circuits, network analysis, package, package parasitics modeling, parasitic elements, simultaneous switching, supply bounce, supply variation, switching, switching noise, transient analysis, transient currents, transient response

Supply and ground variation due to switching noise is an important issue in digital and mixed-mode integrated circuits. An approach for calculating the supply and ground bounce is presented in which the effects of parasitic elements of package and bond wires are considered. The proposed method leads to a system of linear equations whose analytical solution can be used to predict the behavior of supply and ground variations. SPICE simulations are used to verify the accuracy of the approach. The importance of modeling package parasitics and the dependence of switching noise on parasitic elements are also discussed.


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