Batch mode micro-EDM for high-density and high-throughput micromachining

TitleBatch mode micro-EDM for high-density and high-throughput micromachining
Publication TypeConference Paper
Year of Publication2001
AuthorsTakahata, K., and Y. B. Gianchandani
Conference NameMicro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Pagination72 -75
Keywordsaspect ratio, batch mode, batch processing (industrial), Cu, Cu electrode array, electrical discharge machining, electrodes, LIGA, LIGA fabrication, micro-electro-discharge machining, micromachining, multilayer structure, pulse discharge circuit, RC timing circuit, stainless steel, through-hole
Abstract

This paper examines scaling issues for electrode arrays used in micro-electro-discharge machining (micro-EDM). In particular, it explores constraints in the fabrication and usage of high aspect ratio LIGA-fabricated electrode arrays, as well as the limits imposed by the pulse discharge circuits on machining rates. A LIGA-fabricated array of 400 Cu electrodes with 20 square;m diameter was used to machine through-holes in 50 square;m thick stainless steel. An array of multi-layer structures that included tapered shapes was fabricated by the sequential use of three electrode arrays of varying shape. The electrode fabrication and usage for these efforts are described. With respect to the pulse discharge circuits, it is shown that the machining time can be reduced by gt;50% by dividing the electrode array into sections have independent control of pulse discharge timing. This is implemented by using individual RC timing circuits for each section. A correlation between electrode area per RC circuit and machining rate is described

URLhttp://dx.doi.org/10.1109/MEMSYS.2001.906481
DOI10.1109/MEMSYS.2001.906481

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