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| Title | Development of a millimeter-wave system-on-a-package utilizing MCM integration |
| Publication Type | Journal Article |
| Year of Publication | 2001 |
| Authors | Pham, A., R. Ramachandran, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu |
| Journal | Microwave Theory and Techniques, IEEE Transactions on |
| Volume | 49 |
| Pagination | 1747 -1749 |
| Date Published | oct. |
| ISSN | 0018-9480 |
| Keywords | digital ASIC, filter, integral passive device, integrated circuit packaging, MCM integration, microelectromechanical device, millimeter-wave system-on-a-package, millimetre wave integrated circuits, multichip modules, multilayer polymer thin film, radiofrequency integrated circuit, thin film resistor, Wilkinson power combiner |
| Abstract | We present the development of a system-on-a-package at millimeter-wave frequencies utilizing a commercially available multichip-module process. This technology has established a platform for integrating multiple components of different material systems to combine digital application-specific integrated circuits (ASICs), radio-frequency integrated circuits, and microelectromechanical devices onto a package. The multilayer polymer thin films also empower the design and fabrication of integral passive devices, including thin-film resistors, filters, and Wilkinson power combiners |
| URL | http://dx.doi.org/10.1109/22.954779 |
| DOI | 10.1109/22.954779 |