Electrical and Computer Engineering
2332 Main Mall
Vancouver,
BC
Canada
V6T 1Z4
Tel +1.604.822.2872
Fax +1.604.822.5949
Email:
info@ece.ubc.ca
| Title | Development of microwave multilayer plastic-based multichip modules |
| Publication Type | Journal Article |
| Year of Publication | 2001 |
| Authors | Pham, A. - V. H., A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose |
| Journal | Advanced Packaging, IEEE Transactions on |
| Volume | 24 |
| Pagination | 37 -40 |
| Date Published | feb. |
| ISSN | 1521-3323 |
| Keywords | 20 dB, 4 GHz, active microwave circuit, ball grid array, ball grid arrays, Cu, embedded copper wire, FR-4 board, integrated circuit interconnections, integrated circuit packaging, low noise amplifier, microwave multilayer plastic multichip module, MMIC, multichip modules, multilayers, packaging, parasitics, plastic packaging, power amplifier, return loss, surface mount technology, surface mount topology, switch, vertical feedthrough interconnect |
| Abstract | We present the design and development of multilayer plastic-based multichip modules (MCM) at microwave frequencies. A vertical feed-through interconnect, which consists of embedded copper wires in plastic, has been developed to transport RF/microwave and dc signals from the first to the second packaging level. The development of this vertical feed-through enables plastic modules to be configured in a surface mount topology that can be interfaced with low cost FR-4 boards using ball grid arrays (BGA). The experimental analysis results demonstrate that this vertical feed-through used with BGAs has ultra-low parasitics and achieves a return loss of greater than 20-dB at 4-GHz. In addition, we demonstrate a number of packaged active microwave circuits including a switch, a low noise amplifier (LNA) and a power amplifier using the plastic module technology at microwave frequencies |
| URL | http://dx.doi.org/10.1109/6040.909623 |
| DOI | 10.1109/6040.909623 |