Development of Vertical Interconnects for Mixed Substrate Technology

TitleDevelopment of Vertical Interconnects for Mixed Substrate Technology
Publication TypeConference Paper
Year of Publication1999
AuthorsPham, A., A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose
Conference NameARFTG Conference Digest-Spring, 54th
Pagination1 -5
Date Publisheddec.
Abstract

We present the design and development of a vertical interconnect for both multi-chip modules and print circuit board technologies at microwave frequencies. This vertical feed-through provides the electrical interconnects from the first to the second level packaging to allow the use of multiple board technologies for a system. The experimental results demonstrate that the vertical interconnect has ultra-low parasitic and achieves a return loss of greater than 20-dB at 4-GHz.

URLhttp://dx.doi.org/10.1109/ARFTG.1999.327373
DOI10.1109/ARFTG.1999.327373

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