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| Title | Development of millimeter wave multi-layer organic based MCM technology |
| Publication Type | Conference Paper |
| Year of Publication | 1998 |
| Authors | Pham, A., A. Sutono, J. Laskar, V. Krishnamurthy, H. S. Cole, and T. Sitnik-Nieters |
| Conference Name | Microwave Symposium Digest, 1998 IEEE MTT-S International |
| Pagination | 1103 -1106 vol.2 |
| Date Published | jun. |
| Keywords | EHF, equivalent circuit model, equivalent circuits, high performance modules, integrated circuit interconnections, millimeter wave MCM, millimetre wave integrated circuits, multi-layer interconnect, multi-layer organic based MCM technology, multichip modules, ultra low parasitics, vertical stacked via process |
| Abstract | We present the design and development of multi-layer organic based MCM's for use at millimeter wave frequencies. In this technology, we utilize a multi-layer interconnect using a vertical stacked via process. We experimentally develop and analyze an equivalent circuit model for this multi-layer interconnect to millimeter wave frequencies. We demonstrate that this vertical interconnect has ultra low parasitics and can be used to realize high performance modules at millimeter wave frequencies |
| URL | http://dx.doi.org/10.1109/MWSYM.1998.705186 |
| DOI | 10.1109/MWSYM.1998.705186 |