Development of millimeter wave multi-layer organic based MCM technology

TitleDevelopment of millimeter wave multi-layer organic based MCM technology
Publication TypeConference Paper
Year of Publication1998
AuthorsPham, A., A. Sutono, J. Laskar, V. Krishnamurthy, H. S. Cole, and T. Sitnik-Nieters
Conference NameMicrowave Symposium Digest, 1998 IEEE MTT-S International
Pagination1103 -1106 vol.2
Date Publishedjun.
KeywordsEHF, equivalent circuit model, equivalent circuits, high performance modules, integrated circuit interconnections, millimeter wave MCM, millimetre wave integrated circuits, multi-layer interconnect, multi-layer organic based MCM technology, multichip modules, ultra low parasitics, vertical stacked via process
Abstract

We present the design and development of multi-layer organic based MCM's for use at millimeter wave frequencies. In this technology, we utilize a multi-layer interconnect using a vertical stacked via process. We experimentally develop and analyze an equivalent circuit model for this multi-layer interconnect to millimeter wave frequencies. We demonstrate that this vertical interconnect has ultra low parasitics and can be used to realize high performance modules at millimeter wave frequencies

URLhttp://dx.doi.org/10.1109/MWSYM.1998.705186
DOI10.1109/MWSYM.1998.705186

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