Ultra low loss millimeter wave MCM interconnects

TitleUltra low loss millimeter wave MCM interconnects
Publication TypeConference Paper
Year of Publication1997
AuthorsPham, A., J. Laskar, V. Krishnamurthy, H. S. Cole, and T. Sitnik-Nieters
Conference NameElectrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Pagination213 -216
Date Publishedoct.
Keywords75 to 110 GHz, integrated circuit interconnections, losses, microstrip components, microstrip passive components, millimeter wave MCM interconnects, millimetre wave circuits, multichip modules, organic interconnect packaging technology, ultra-low loss interconnects, W-band
Abstract

We present the design and development of ultra low loss and high density organic interconnect packaging technology at millimeter wave frequencies. Various microstrip passive components have been designed and characterized to demonstrate that the high density organic interconnect approach is suitable for W-band (75 GHz-110 GHz) packaging. The loss of the organic interconnects has been found to be comparable with that of microstrip lines on alumina substrates at W-band frequencies

URLhttp://dx.doi.org/10.1109/EPEP.1997.634073
DOI10.1109/EPEP.1997.634073

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